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X-ray Inspection (AXI) in Electronics: Hidden Joint Analysis

24 July 26

Automated X-ray Inspection (AXI) Technologies for Components…

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Content

Limitations of Optical Inspection (AOI) for Hidden Joints
Operating Principles: AXI 2D vs 2.5D vs 3D CT
BGA Component Analysis and Critical Defect Detection
Calculation of Voiding Percentage and IPC-A-610 Criteria
Through-Hole Component Inspection (THT) and Barrel Filling
Counterfeit Analysis (Counterfeit IC Detection)
Integration of AXI into the Production Line: Inline vs Offline
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Posts

Reliability in Electronics: HALT, HASS Tests and MTBF Calculation
X-ray Inspection (AXI) in Electronics: Hidden Joint Analysis
Lead-Free Welding (RoHS): Alloys, Profiles, and Challenges in SMT
Bootloader Design and OTA Updates for Embedded Systems
IC Serialization: Traceability and Control in Electronic Manufacturing

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We have a team of professionals with more than 20 years of experience in the electronics industry in Mexico, offering specialized support in various areas of manufacturing, including electronics, plastics, automotive, medical and food.

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