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X-ray Inspection (AXI) in Electronics: Hidden Joint Analysis

24 July 26

Automated X-ray Inspection (AXI) Technologies for Components…

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Content

Limitations of Optical Inspection (AOI) for Hidden Joints
Operating Principles: AXI 2D vs 2.5D vs 3D CT
BGA Component Analysis and Critical Defect Detection
Calculation of Voiding Percentage and IPC-A-610 Criteria
Through-Hole Component Inspection (THT) and Barrel Filling
Counterfeit Analysis (Counterfeit IC Detection)
Integration of AXI into the Production Line: Inline vs Offline
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Posts

Reliability in Electronics: HALT, HASS Tests and MTBF Calculation
X-ray Inspection (AXI) in Electronics: Hidden Joint Analysis
Lead-Free Welding (RoHS): Alloys, Profiles, and Challenges in SMT
Bootloader Design and OTA Updates for Embedded Systems
IC Serialization: Traceability and Control in Electronic Manufacturing

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