Component Preforming

Baking and Drying Service for Components

Component Baking and Drying is a critical process in the electronics industry that helps eliminate moisture build-up in components, ensuring their performance and durability during assembly and final operation. Reliable baking and drying service, meeting the highest quality standards and industry regulations.

Service Applications

Printed Circuit Board (PCB) Assembly: Ideal for components that will be soldered onto PCBs to avoid soldering defects.

Moisture Sensitive Components: Designed for components that absorb moisture and need to be dried before use, such as semiconductor devices.

Preparing for High Demand Manufacturing: Suitable for applications where reliability is crucial, such as in the automotive, medical and aerospace industries.

Open Partials or Material with HIC's Warning: We help you eliminate dangerous moisture content for the component or your assembly in the Reflow oven process

Benefits of Baking and Drying Components

Failure Prevention: Moisture removal helps prevent defects such as bubble formation and other problems during the soldering process.

Extending Shelf LifeBy removing moisture, the risk of oxidation and other deterioration is reduced, extending the life of the components.

Regulatory Compliance: Our baking and drying process meets industry requirements (such as JEDEC J-STD-033), ensuring components are ready for assembly to standards.

Why Choose Us?

At SBC Group, we understand the importance of precision drying and baking in electronics manufacturing. Our specialized team has the tools and knowledge to carry out the process with the utmost precision, ensuring that each component meets the required standards before being used in assembly.

High Performance Team: We use ovens specifically designed for moisture removal from electronic components.

JEDEC Compliance: All our procedures follow JEDEC J-STD-033 guidelines for the protection of moisture-sensitive devices.

Experience and Reliability: More than 20 years of experience in the sector, supporting our clients with high quality and reliable services.

Our Component Baking Process

Reception and Evaluation of Components: Upon receiving the components, we evaluate their condition and define the optimal time and temperature for baking.
Oven Settings: We adjust the oven to meet specific component parameters (temperature, time and airflow) according to JEDEC standards.
Baking Process: The components are subjected to the baking process for the time necessary to eliminate moisture without compromising their structural integrity.
Controlled cooling: After baking, the components undergo controlled cooling before packaging to prevent them from absorbing moisture again.
Vacuum Packaging: Dry components are packaged in airtight, humidity-controlled bags to ensure stability until final use.
Delivery and Documentation: A detailed report is provided to the customer with process traceability, including baking temperatures and times.

Do you need more information about our service? Drying? Contact us!

With our service of Baking and Drying of ComponentsWe ensure that your electronic components are ready to be assembled without the risk of problems arising from humidity.

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